Advanced electrical interfaces to sensors and transducers
Specialized in high-performance, ultra-low-power custom ICs developments, leveraging advanced analog front-end architectures and precision data conversion. These ICs enable next-generation performance with compact size, combining low noise, high accuracy, and minimal power consumption for even the most demanding environments.
- Feasibility study and architectural definition
- System trade-offs versus design risk and complexity
- Selection of technology and package
- Performance, power, area calculations
- First risk analysis (FME(D)A)
- Functional Safety (DIA)
IC Definition
- Resistive sensor interfaces: Wheatstone bridge readout
- Capacitive sensor interfaces: tilt, accel, gyro, pressure, C-V interfaces with aF sensitivity
- Piezoelectric interfaces: charge amplification
- Absolute accuracy of uVrms: block and system-level chopping, low noise, low temperature sensitivity
- Offset compensation (CDS, Chopping, …), kT/C noise cancellation
- High accuracy, fully integrated temperature sensors
- Delta-Sigma (ΔΣ) analog-to-digital (AD) converters: continuous and discrete time
- Delta-sigma (LP, BP), (SC, CT, extended counting)
- Successive approximation AD converters
- Cyclic, Algorithmic and SAR ADC
Pipelined ADC - Current steering DAC
- Delta-Sigma DAC
Development and Verification
- Design of advanced analog, mixed-signal, high-voltage integrated circuits
- Digital design, VHDL/Verilog coding, verification, synthesis, STA, LEC, …
- Design for testability (DFT), ATPG, scan chain
- Full PVT (process voltage temperature) simulations
- Layout and digital place & route
- ESD/LU, EMC, MRI, ISO pulses, …
Assembly
- QFN, BGA, SOT, SOP, TSSOP, ceramic, …
- Bumping (incl. RDL), WLCSP (Wafer Level Chip Scale Packaging) solutions
- Delivery of bare dies in various forms
- Custom solutions like stacking, chip-on-flex, chip-on-glass, chip-on-board (COB) and System-in-Package (SiP)
