MEMS & IC Solutions
We provides plastic, leadless, die-form and ceramic packaging solutions tailored to your application’s electrical, thermal, and mechanical needs.
Packaging
- Die-form like WLCSP, COB (Chip-On-Board) enables compact, high-performance integration for wearables and portable devices
- Plastic packages (SOIC, TSSOP, QFN, DIP) deliver cost-effective scalability for industrial and consumer electronics
- Ceramic packages offer hermetic sealing and high reliability for space, imaging and aerospace-grade MEMS
Functional Testing
100% wafer level test on automatic probe station. KGD mapping files and electro-mechanical tests data shall be delivered
Electrical parameters:
- Rest capacitance
- Capacitance variation
Resistance values
Mechanical parameters:
- Resonance frequency between 1kHz and 50kHz
- Quality factor between 100 and 1M
